
AMD’s Ryzen 5000 Desktop CPUs, based on the Zen 3 core architecture and the respective X570 motherboard platform, have received some excellent reviews from the technology community and are considered one of AMD’s best CPU series to date and offer insane amounts achievement. However, Custom DIY PC Builder, PowerGPU, reports that they are seeing very high failure rates with the new AMD CPU and motherboard platform.
AMD Ryzen 5000 ‘Zen 3’ Desktop CPUs and X570 Motherboards have reportedly sent high failure rates, multiple CPUs to PowerGPU DOA
PowerGPU tweeted that AMD’s Ryzen 5000 CPUs have very high failure rates and this increases with the more high-quality CPU offerings. AMD is currently struggling with the huge demand for its Ryzen 5000 and Ryzen 3000 processors, both of which are based on TSMC’s 7nm process node. Despite shipping a million Ryzen 5000 units in the previous quarter, AMD lost CPU market share to Intel for the first time since the launch of the first Zen-based Ryzen series.
The failure on the new AMD CPUs is still too high.
AMD Ryzen 5950x x50 units 8 doa
AMD Ryzen 5900x x50 units 4 doa
AMD Ryzen 5800x x100 units 4 doa
AMD Ryzen 5600x x120 units 3 doaWe only had 1 dead Intel CPU, that was a 9700 000 in our business time
Doa: death on arrival
– PowerGPU® (@PowerGPU) 13 February 2021
In the tweet, PowerGPU reports that out of the 50 Ryzen 9,5950X units they received, 8 CPUs were DOA (dead on arrival). Following is a breakdown of the failure rate of AMD Ryzen 5000 CPUs as reported by the custom DIY PC builder:
- AMD Ryzen 5950x x50 units 8 doa
- AMD Ryzen 5900x x50 units 4 doa
- AMD Ryzen 5800x x100 units 4 doa
- AMD Ryzen 5600x x120 units 3 doa
At the same time they report that during the same time they received only 1 Intel CPU which turned out to be DOA and it was a 9th Gen Core i7-9700K chip. PowerGPU also mentions that before the launch of AMD’s Ryzen 5000 CPUs, the failure rate was 80% Intel and 20% AMD and that they had killed only one CPU in the past two years. But since the launch of Ryzen 5000 CPUs, the chips have seen higher failure rates. The issue is also not only specific to the CPUs, even X570 boards are apparently experienced with very high failure rates.
Yes, we had it too. Just weird problems with certain.
– PowerGPU® (@PowerGPU) 14 February 2021
Doa as in it was dead when we built the computer here. So we switch the CPU and it works.
– PowerGPU® (@PowerGPU) 13 February 2021
We have tried all the CPUs of different brands and the chipset b550, x570 abd still have the same problem. Change it for another 5000 series CPU and it works.
– PowerGPU® (@PowerGPU) 13 February 2021
Yes, it is normal like 0.01% at processors.
– PowerGPU® (@PowerGPU) 13 February 2021
The company reports that they get at least 3-5 X570 and B550 motherboards each week that end up being DOA. It remains to be seen whether this is a production issue or something else. There are still many people who have been running their AMD Ryzen 5000 PC builds without any issues since its launch, but given the high failure rate reported here, it is definitely something worth investigating. Others reported problems where the USB 3 lanes on Ryzen 5000 CPUs were almost dead and gave rise to strange stability issues.
Update: It seems like these issues may be widespread in the DIY computer building community. Harukaze5719 spoke to a Korean DIY PC Builder who reports similar flaws and failures while using Ryzen 5000 Desktop CPUs on X570 / B550 motherboards.
In Korea, it was quite quiet on this issue.
While I have been checking urgently, there have been regular posts over the past few months complaining about issues occurring mainly on B550 / X570 mobo. https://t.co/pNizhKZn0R– 포시 포시 (@ harukaze5719) 14 February 2021
Processors that work but that have poor FCLK overclocking functions or have incorrect CPPC labels in relation to FIT and temperature are not counted. https://t.co/NeL5ae1e8F
– Yuri Bubliy (@ 1usmus) 14 February 2021
In addition, 1usmus (Yuri Bubliy) says that apart from DOA chips, Ryzen 5000 CPUs that have poor FCLK overclocking functions and incorrect CPPC labels relative to FIT and temperature are not even offset within these numbers.